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Chapter 4

Computer Hardware Chapter 4

Multiple Choice
Identify the choice that best completes the statement or answers the question.

____ 1. Processor core frequency is measured in ____.
a. hertz c. gigahertz
b. megahertz d. terahertz


____ 2. Memory on the processor die is called ____ cache.
a. Level 1 c. Level 3
b. Level 2 d. Level 4


____ 3. Memory in the processor package, but not on the processor die, is called ____ cache.
a. Level 1 c. Level 3
b. Level 2 d. Level 4


____ 4. Intel’s ____ allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package.
a. Hyper-Execution c. HyperTransport
b. Multi-Threading d. Hyper-Threading


____ 5. ____ hold counters, data, instructions, and addresses that the ALU is currently processing.
a. Logic units c. Registers
b. Caches d. Shifters


____ 6. Installing more than one processor on a motherboard creates a ____.
a. multiprocessor platform c. variable platform
b. wide platform d. uniprocessor platform


____ 7. Intel’s current families of processors for the desktop include four major groups: ____.
a. the Pentium, the Phenom, the Celeron, and the Atom families
b. the Core, the Pentium, the Celeron, and the Atom families
c. the Sempron, the Core, the Celeron, and the Atom families
d. The Core, the Pentium, the Celeron, and the Molecule families


____ 8. Using the ____ technology, the Intel processor, chipset, and wireless network adapter are all interconnected as a unit, which improves laptop performance.
a. Centrino c. vPro
b. Core d. Centrum


____ 9. The cooler sits on top of the processor and consists of a fan and a heat ____, which are fins that draw heat away from the processor.
a. dump c. pump
b. pipe d. sink


____ 10. A ____ is a heat sink carrying an electrical charge that causes it to act as an electrical thermal transfer device.
a. Moirre c. pelted
b. peltier d. perrier


____ 11. The peltier’s top surface can be as hot as ____ degrees F.
a. 45 c. 375
b. 150 d. 500


____ 12. The peltier’s top surface can be as cool as ____ degrees F.
a. 45 c. 375
b. 150 d. 500


____ 13. The most popular method of cooling overclocked processors is a(n) ____.
a. air boosted system c. liquid cooling system
b. peltier system d. heat pipe system


____ 14. The current set of standards that is used by BIOS, hardware, and the OS to manage power is ____.
a. Advanced Connection and Programming Interface
b. Advanced Configuration and Programming Interface
c. Advance Connection and Power Interface
d. Advanced Configuration and Power Interface


____ 15. If a power-on password has been forgotten, you can use the BIOS ____ to reset the password.
a. jumper pad c. solder group
b. jumper group d. solder pads


____ 16. The CMOS battery failure can be reported by startup BIOS during the ____.
a. firmware c. POST
b. OST d. Self Test


____ 17. Processors can sense their operating temperatures and report that information to ____.
a. BIOS c. RAM
b. CMOS d. CPU


____ 18. The temperature inside the case should not exceed ____ degrees C.
a. 27 c. 57
b. 38 d. 100


____ 19. Intel and AMD both recommend a ____ air guide as part of the case design.
a. platform c. power supply
b. component d. chassis


____ 20. When you hear ____ during post, you know that a keyboard controller failed or video controller failed.
a. Two beeps
b. Three beeps followed by three, four, or five beeps
c. Four beeps followed by two, three, or four beeps
d. One beep followed by three, four, or five beeps


____ 21. When you hear ____ during post, you know that you have a problem with serial or parallel ports or system timer, which probably means the motherboard must be replaced.
a. Two beeps
b. Three beeps followed by three, four, or five beeps
c. Four beeps followed by two, three, or four beeps
d. One beep followed by three, four, or five beeps


Matching

Match each term with the correct statement below.
a. Field replaceable units f. Overclocking
b. Processor frequency g. C states
c. Memory cache h. Back-side bus
d. Registers i. Microcode
e. P states


____ 22. Small holding areas on the processor chip that work much as RAM does outside the processor

____ 23. The portion of the internal bus that connects the processor to the internal memory cache

____ 24. The speed at which the processor operates internally

____ 25. Running a motherboard or processor at a higher speed than the manufacturer suggests

____ 26. RAM that holds data and instructions that the memory controller anticipates the processor will need next

____ 27. Groups of instructions that accomplish fundamental operations

____ 28. Save power by lowering the CPU frequency and voltage

____ 29. Used by the processor to stop its internal operations to conserve power

____ 30. Items that can be exchanged without returning the motherboard to the factory
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